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PCX755BVZFU300LE
Deskripsi:
PCX755BVZFU300LE datasheet pdf and Embedded - Microprocessors product details from Microsemi stock available at Rozee
Kategori:
Sirkuit terintegrasi (IC)
Spesifikasi
Part Number:
PCX755BVZFU300LE
Manufacturer:
Microsemi
Description:
In stock. Alternative models available.
Lifecycle:
New from this manufacturer
Delivery:
DHL、UPS、FedEx、Registered Mail
Payment:
T/T Paypal Visa Western Union
More Information:
PCX755BVZFU300LE More Information
ECAD:
Request Free CAD Models
Pricing(USD):
$0.00
Remark:
Manufacturer: Microsemi.
Rozee is one of the Distributors.
Wide range of applications.
Case/Package:
FCBGA
Data Bus Width:
32 b
Max Operating Temperature:
110 °C
Products Category:
Integrated Circuits (ICs) - Embedded - Microprocessors
Qty:
772 In Stock
Applications:
Wireless infrastructure
Data center & enterprise computing
Gaming
Max Frequency:
300 MHz
Core Architecture:
PowerPC
Min Operating Temperature:
-40 °C
Nomor model:
PCX755BVZFU300LE
Pengantar
PCX755BVZFU300LE Overview\\nPCX755BVZFU300LE is a model belonging to the Embedded - Microprocessors subcategory under Integrated Circuits (ICs). For specific product performance parameters, please refer to the data sheet, such as PDF files Docx documents, etc. We have PCX755BVZFU300LE high-definition pictures and data sheets for reference. We will continue to produce various video files and 3D models for users to understand our product more intuitively and comprehensively.
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