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LMC6081AIMX/NOPB

Deskripsi:
LMC6081AIMX/NOPB datasheet pdf and Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps product details from Texas Instruments stock available at Rozee
Kategori:
Sirkuit terintegrasi (IC)
Spesifikasi
Part Number:
LMC6081AIMX/NOPB
Manufacturer:
Texas Instruments
Description:
In stock. Alternative models available.
Lifecycle:
New from this manufacturer
Delivery:
DHL、UPS、FedEx、Registered Mail
Payment:
T/T Paypal Visa MoneyGram Western Union
More Information:
LMC6081AIMX/NOPB More Information
ECAD:
Request Free CAD Models
Pricing(USD):
$2.85
Remark:
Manufacturer: Texas Instruments. Rozee is one of the Distributors. Wide range of applications.
Mount:
Surface Mount
Height:
1.75 mm
Packaging:
Tape and Reel
Thickness:
1.58 mm
Case/Package:
SOIC
Number of Pins:
8
Input Bias Current:
10 fA
Min Supply Voltage:
4.5 V
Number of Circuits:
1
Gain Bandwidth Product:
1.3 MHz
Operating Supply Current:
550 µA
Min Operating Temperature:
-40 °C
Output Current per Channel:
34 mA
Max Junction Temperature (Tj):
85 °C
Products Category:
Integrated Circuits (ICs) - Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Qty:
9663 In Stock
Applications:
Wired networking Datacom module TV
Width:
3.91 mm
Length:
4.9 mm
Slew Rate:
1.5 V/µs
Schedule B:
8542330000
Voltage Gain:
122.92 dB
Output Current:
34 mA
Max Supply Voltage:
15.5 V
Number of Channels:
1
Number of Elements:
1
Nominal Supply Current:
550 nA
Max Operating Temperature:
85 °C
Input Offset Voltage (Vos):
150 µV
Common Mode Rejection Ratio:
75 dB
Power Supply Rejection Ratio (PSRR):
75 dB
Nomor model:
LMC6081AIMX/NOPB
Pengantar
LMC6081AIMX/NOPB Overview\\\\nLMC6081AIMX/NOPB is a model belonging to the Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps subcategory under Integrated Circuits (ICs). For specific product performance parameters, please refer to the data sheet, such as PDF files Docx documents, etc. We have LMC6081AIMX/NOPB high-definition pictures and data sheets for reference. We will continue to produce various video files and 3D models for users to understand our product more
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